The laser beam from the semiconductor laser is reflected by a polygonal mirror and a plane mirror, and the beam passes through a collimating F(θ) lens. With the target object scanned, the beam is converged by a receiver lens and converted into an electron
Laser Scanning Schematic Diagram
32-bit DSP and 32 MCU microprocessor chip are used to ensure data calculation and output capabilities. The dedicated measurement algorithm and the high-precision hardware are combined to ensure data stability and accuracy after long-term use of the diameter gauge.
Modes of measurement
Types of measurement
Width & Thickness measurement
Lump & Neck flaw detection
Imported high-speed micro-motor (high scanning frequency), military-grade process laser (high collimation), design and processing of the latest aspheric optical system, and optimized specific edge detection algorithm are adopted. The diameter gauge can realize a scanning frequency up to 2400 Times/S (per axis) and accurate identification of the edges of the object under test, ensuring that more single scanning values of the object under test are obtained in one measurement cycle. High-precision single-cycle accurate data collection can reflect the dimensional changes and surface defects. The particles, paint bumps, bubbles, blisters and other surface defects of the products can be detected within a very small scanning interval. The defects larger than the minimum measurement interval can be accurately detected. For the measurement of flat objects in particular, the optimized edge algorithm is combined to more accurately measure their width and thickness, which is not available in traditional methods of measurement or measuring instruments with a low scanning frequency.